此技術已獲得臺灣及美國發明專利，並於6個月的時間獲證，證實該技術具有新穎性及原創性。而該技術移轉予德國Schlötter公司(台灣萬億公司代理)，已通過多項驗證。目前已於2017年第三季商業化，產品名稱為”SLOTOGO”，預估3D IC封裝產品的全球價值將增長到398億，目前該公司正為許多大公司製造許多樣品；由於該技術具有高頻傳輸的潛力(即5G)，也已成功獲得世界知名之比利時微電子研究中心(imec)青睞，與NCHU簽訂合作協議書，進行5G IC的創新測試。

The plating technology has obtained the USA and Taiwan patents. It only took 6 months for obtaining the two patents from application to get patent, showing that the technology is novel and original. The technology has been transferred to a Germany company, Schlötter, and has passed many critical tests. Now, the technology has been commercialized in 3Q of 2017. The product name is called “SLOTGO”. It predicts that the global value of output of 3D IC packaging will grow up to 398 hundred million. Currently, many samples are being made by the company for many big companies. Since this technology is potential for high frequency transmission (i.e.,5G), imec in Belgium is interested and has signed a collaboration contract with NCHU to try its performance for 5G IC device.

還原氧化石墨烯、直接電鍍銅技術、高頻傳輸線路

Reduced Graphene Oxide (rGO), Direct Copper Plating Technology, Conductive Lines with High Frequency Transmission