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- patent name / Low-density Wood-based Composites Prepared from Eco-friendly Foam Adhesive
- inventor / Yi-Chun Chen
- Patent number /
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Nowadays, solvents and formaldehyde already are used in a variety of adhesive. The bio-based composites contained wood and/or bamboo charcoal fulfilled the requirement of the Chinese National Standard of particleboard. The dimensionally stable low-density composite has a high potential to substitute traditional indoor building materials. Green process Non-solvent Non-formaldehyde Low-density Strength meets national standards High dimensionally stable
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Foam Adhesive; Composites; Green process
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